MediaTek – TSMC’s 3nm process technology
MediaTek and TSMC (Taiwan Semiconductor Manufacturing Company Limited) today officially announced that MediaTek has successfully developed its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production.
MediaTek’s first flagship chipset using TSMC’s 3nm process is expected to empower smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024.
This news was officially confirmed by MediaTek in its official blogpost
“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
According to TSMC Senior Vice President of Sales for Europe and Asia, Cliff Hou, the partnership will focus on bringing the most advanced technology of the moment to the most affordable mobile phones on the market.
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“
These are the main highlights of the new MediaTek’s first flagship chipset developed using TSMC’s 3nm process;
- TSMC’s 3nm process technology provides enhanced performance, power, and yield, in addition to complete platform support for both high-performance computing and mobile applications.
- Compared with TSMC’s N5 process, TSMC’s 3nm technology currently offers as much as 18% speed improvement at the same power, or 32% power reduction at the same speed, and approximately 60% increase in logic density.
- MediaTek’s Dimensity SoCs, built with industry-leading process technology, are designed to meet the ever-increasing user experience requirements for mobile computing, high-speed connectivity, artificial intelligence, and multimedia.
- MediaTek’s first flagship chipset using TSMC’s 3nm process is expected to empower smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024.